SBU
With the shrinking component footprints and increasing component densities demanded by today's technology, sequential build-ups are often the only solution for the PCB construction.
Graphic have many years experience of producing these types of construction, incorporating buried, blind and micro vias in a range of sub-assembly combinations.
We have also invested in both copper fill and resin processes, and these combined with our in-house IST testing ensure that the reliability of these constructions meets the demands of lead-free assembly and of our military and reliability dependent customers.
Some key features of SBU technology that we offer are:
- Standard micro via
- Copper filled micro via
- Stacked micro via (3 layers +)
- Resin filled buried and through vias
- Resin filled and copper capped buried and through vias